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    View The Printed Circuit Assembler's Guide to: X-Ray Inspection by Bill CardosoPreview
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    The Printed Circuit Assembler's Guide to: X-Ray Inspection

    by Bill Cardoso

    This is the price your customers see. Edit list price

    Softcover
    Flexible, high-gloss laminated cover
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    About the Book

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    In this unique approach to X-ray inspection, Dr. Cardoso takes the reader through the history of X-ray technology, beginning with Wilhelm Conrad Roentgen's 1895 discovery of X-rays, which revolutionized medical imaging. This led to the development of modern X-ray machines used in various fields, including electronics. These machines are designed through imaging, motion, and decision steps, with the 1980s invention of the ball grid array (BGA) package simplifying defect detection. Key components include the X-ray source and sensor, with important parameters like focal spot size and pixel size. Imaging configurations, magnification types, and radiation intensity are crucial for system performance. X-ray inspection in electronics manufacturing identifies common defects in SMT assembly, while safety aspects emphasize proper handling, minimizing radiation exposure, and compliance with regulations.
    Features & Details

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    • Primary Category: Education
    • Additional Categories Reference
    • Project Option: 6×9 in, 15×23 cm
      # of Pages: 64
    • Isbn
      • Softcover: 9781959894216
    • Publish Date: Feb 26, 2025
    • Language English
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    About the Creator
    I-007eBooks
    IPC Publishing Group, Inc.
    Bannockburn, IL

    IPC Publishing Group, Inc. dba I-Connect007, is dedicated to educating and informing the electronics interconnect supply chain community with content worth sharing. I-007eBooks was launched in 2017 with a micro eBook "guide to" series. I-007eBooks.com is the library for our main site, I-Connect007.com.

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    • © 2015 - 2025 RPI Print, Inc.
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